Citation: | HE Xu, ZHANG Zhen-hai, LI Ke-jie, LIN Ran. Triaxial high-gaccelerometer of microelectro mechanical systems[J].JOURNAL OF BEIJING INSTITUTE OF TECHNOLOGY, 2015, 24(4): 427-431.doi:10.15918/j.jbit1004-0579.201524.0401 |
[1] |
Li R, Chen K, Kang X G, et al. Hard target smart fuze detonating control summary[J]. Journal of Detection and Control,2010,32(6):1-4. (in Chinese)
|
[2] |
Li K J. Modern sensor technology[M]. Beijing: Publish House of Electronics Industry, 2005. (in Chinese)
|
[3] |
Cheng Q X.Experimental research on ultra-precision grinding technology for silicon wafer tinning[D]. Dalian : Dalian University of Technology, 2013. (in Chinese)
|
[4] |
Shi Y B, Zhu Z Q, Liu X P, et al. Design and impact analysis of a high-
gaccelerometer[J]. Explosion and Shock Waves, 2010,30(3): 329-332. (in Chinese)
|
[5] |
Li P, Shi Y B, Zhu Z Q, et al. An optimization method for natural frequency of MEMS high-
gaccelerometer[J]. Chinese Journal of Sensor and Actuators,2013,23(3): 388-392. (in Chinese)
|
[6] |
Fan J B, Zu J, Lin Z S, et al. Shock calibration for a high-
gaccelerometer using a laser interferometer[J]. Journal of Vibation and Shock,2012,31: 149-153. (in Chinese)
|
[7] |
Wu Z C, Ge Y, Yu C D. E-type 3-D accelerometer's design based on thick film technology[J]. Sensor Technology,2011,9:3-7. (in Chinese)
|