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Article Navigation> JOURNAL OF BEIJING INSTITUTE OF TECHNOLOGY> 2010> 19(1): 82-86
ZHANG Zhao-hui, ZAHNG Chun, WANG Fu-chi, LI Shu-kui. Effect of Annealing Process on Microstructure and Mechanical Properties of Ultrafine Copper Prepared by Spark Plasma Sintering[J]. JOURNAL OF BEIJING INSTITUTE OF TECHNOLOGY, 2010, 19(1): 82-86.
Citation: ZHANG Zhao-hui, ZAHNG Chun, WANG Fu-chi, LI Shu-kui. Effect of Annealing Process on Microstructure and Mechanical Properties of Ultrafine Copper Prepared by Spark Plasma Sintering[J].JOURNAL OF BEIJING INSTITUTE OF TECHNOLOGY, 2010, 19(1): 82-86.
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Effect of Annealing Process on Microstructure and Mechanical Properties of Ultrafine Copper Prepared by Spark Plasma Sintering

  • School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China

  • Received Date:2009-04-10
    Abstract
  • The spark plasma sintering (SPS) method is used to prepare the ultrafine copper with the average grain size less than 10μm and the tensile strength greater than 280MPa. The ultrafine copper is annealed at different temperatures for 60min, and the annealing microstructure is observed and the hardness and the deformation behavior of the bulk copper are tested. The results indicate that the grains grow very slowly when the annealing temperature is less than 450℃. However, the grain growth becomes remarkable when the annealing temperature exceeds 450℃. And the plasticity of the bulk copper is the best when the annealing temperature of 450℃ is adopted. After stamping and spin forming, the deformed copper is recrystallized completely and the grain is refined when the copper is annealed at 500℃ for 30min.
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    • References (15)
  • [1]
    Murr L E, Ferreyra E, Pappu T S, et al. Novel deformation processes and microstructures involving ballistic penetrator formation and hypervelocity impact and penetration phenomena[J]. Materials Characterization, 1996, 37(5): 245-276.
    [2]
    Chen W, Anselmi-Tamburini U, Garay J E, et al. Fundamental investigations on the spark plasma sintering／synthesis process: Ⅰ. effect of dc pulsing on reactivity[J]. Materials Science and Engineering A, 2005, 394(1-2): 132-138.
    [3]
    Vanmeensel K, Laptev A, Hennicke J, et al. Modelling of the temperature distribution during field assisted sintering[J]. Acta Materialia, 2005, 53(16): 4379-4388.
    [4]
    Zhang Z H, Wang F C, Wang L, et al. Sintering mechanism of large-scale ultrafine-grained copper prepared by SPS method[J]. Materials Letters, 2008, 62(24): 3987-3990.
    [5]
    Kim C K, Lee H S, Shin S Y, et al. Microstructure and mechanical properties of Cu-based bulk amorphous alloy billets fabricated by spark plasma sintering[J]. Materials Science and Engineering A, 2005, 406(1-2): 293-299.
    [6]
    Khor K A, Cheng K H, Yu L G, et al. Thermal conductivity and dielectric constant of spark plasma sintered aluminum nitride[J]. Materials Science and Engineering A, 2003, 347(1-2): 300-305.
    [7]
    Shearwood C, Fu Y Q, Yu L, et al. Spark plasma sintering of TiNi nano-powder[J]. Scripta Materialia, 2005, 52(6): 455-460.
    [8]
    Kumar R, Prakash K H, Cheang P, et al. Microstructure and mechanical properties of spark plasma sintered zirconia-hydroxyapatite nano-composite powders[J]. Acta Materialia, 2005, 53(8): 2327-2335.
    [9]
    Zavaliangos A, Zhang J, Krammer M, et al. Temperature evolution during field activated sintering[J]. Materials Science and Engineering A, 2004, 379 (1-2): 218-228.
    [10]
    Zhan G D, Kuntz J, Wan J, et al. Alumina-based nanocomposites consolidated by spark plasma sintering[J]. Scripta Materialia, 2002, 47(11): 737-741.
    [11]
    Matsugi K, Kuramoto H, Hatayama T, et al. Temperature distribution at steady state under constant current discharge in spark sintering process of Ti and Al 2O 3powders[J]. Journal of Materials Processing Technology, 2003, 134(2): 225-232.
    [12]
    Cha S I, Kim K T, Lee K H, et al Strengthening and toughening of carbon nanotube reinforced alumina nanocomposite fabricated by molecular level mixing process[J]. Scripta Materialia, 2005, 53(7): 793-797.
    [13]
    Wan J, Duan R G, Mukherjee A K. Spark plasma sintering of silicon nitride/silicon carbide nanocomposites with reduced additive amounts[J]. Scripta Materialia, 2005, 53(6): 663-667.
    [14]
    Zhang Z H, Wang F C, Wang L, et al. Microstructural characteristics of large-scale ultrafine-grained copper[J]. Materials Characterization, 2008, 59(3): 329-333.
    [15]
    Zhang Z H, Wang F C, Wang L, et al. Ultrafine-grained copper prepared by spark plasma sintering process[J]. Materials Science and Engineering A, 2008, 476(1-2): 201-205. (Edited by
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