硕士研究生刘开源和陈鹏万教授、周强老师在《International Journal of Refractory Metals and Hard Materials》上发表题为“Fabrication and characterization of the Mo/Cu bimetal with thick Mo layer and high interfacial strength”的学术文章（2021，94，105383，doi: 10.1016/j.ijrmhm.2020.105383）。本项工作主要通过预热钼板爆炸焊接的方法制备大厚度钼/铜高结合强度双金属片。利用电加热的方法将5mm厚钼板加热到500度以上，达到“热软化”的效果后，再进行爆炸焊接，得到无裂纹钼/铜复合板，对焊接板进行微观结构和力学性能表征。第一作者刘开源为课题组硕士三年级学生，第二作者是机电学院陈鹏万教授。

　　论文摘要： Due to the brittleness of molybdenum (Mo) and high difference in melting point, it is still a challenge to clad thick Mo onto copper (Cu) with high quality bonding. In this study, a 5 mm thick Mo plate was successfully welded with Cu plate by hot explosive welding, without any cracks being formed. The maximum shear strength of the interface exceeded 295 MPa. The calculated weldability window indicated that the welding was achieved with the parameters close to the lower boundary, and successfully predicted the wavy interfaces. The interfacial microstructures were investigated by scanning electron microscope, electron backscatter diffraction and transmission electron microscopy, the results showed that the dislocations in Cu were higher than the Mo side and the evolutions of interfacial structure due to severe deformation, such as misorientation angle, recrystallization and texture, were quite different for Mo and Cu.

　　论文链接：https://www.sciencedirect.com/science/article/pii/S0263436820302596